SMT Printing Collapse Causes and Countermeasures --KINGSUN

The frst process in the SMT industry is solder paste printing. After the solder paste prining is completed, electronic components are atached to PcB pads through aSMT machine, and then reflow soldered. A preliminary PCB board is roughly processed.

SMT is a combination of multiple devices, and such a line is called an SMT production line. Our common PcBA is processed through this process.

In SMT technology,each process is very important, and poor qualty can be caused by diferent process defects. Today, we are discussing the causes andcountermeasures of SMT printing collapse.

SIMT printing collapse refers to the colapse of solder paste on PcB pads without forming. Common causes and countemeasures are as follows:

Reasons:

Solder paste is printed onto PCB pads throuoh the steel mesh and scraper of the solder paste pinting machine, and the reason for colapse is due to the stronafluidity of the solder paste, which is caused by insufficient viscosity of the solder paste.

The strong fluidity and insuficient viscosily of solder paste are mainly due to excessive stiring, resuling in a decrease in viscosity. On the other hand. the soldeipaste itself has fewer components and thickeners.

Countermeasure:

The best condition is to ensure normal heating time ofthe solder paste, stir evenly, and the solder paste can continuously infitrate when lifted up. in adition, higherviscosity solder paste should be used.

Regarding sMT printing related knowledge, KINGSUN share with you here,hoping to be helpful to you, More informaion about Products please Contac

US at jenny@ksunsmt.com or visit www.ksunsmt.com.