Solder Paste Inspection Machine (SPI) | 2D & 3D Systems | SMTFullLine
2026-04-12 10:49
Solder Paste Inspection Machine (SPI): The Quality Gate After Printing
A solder paste inspection machine (SPI) measures the volume, height, area, and alignment of solder paste deposits. It is the most effective way to prevent printing defects from becoming soldering defects. SMTFullLine offers 2D and 3D SPI systems for small and large lines.
What an SPI Machine Measures
| Parameter | Purpose |
|---|---|
| Volume | Detects insufficient or excess paste |
| Height | Reveals stencil clogging |
| Area | Checks coverage on pad |
| Offset | Measures stencil‑to‑board alignment |
2D vs 3D SPI
2D SPI – Measures area and position. Lower cost but cannot measure height accurately.
3D SPI – Uses phase shift or laser to measure full volume and height. Essential for fine‑pitch components.
SMTFullLine’s SPI Offerings
We offer benchtop 3D SPI (under $10,000) for small lines and inline 3D SPI for fully automated production. All systems generate Cp/Cpk reports and can feed data back to the printer (closed loop).
Stop chasing solder defects – inspect the paste first.
See SPI options at SMTFullLine.com.
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