The Lead Free Reflow Oven is critical for achieving reliable solder joints in compliance with international environmental regulations.
Precise temperature profiling
Multiple heating zones
Stable heat distribution
Options for nitrogen atmosphere
Works seamlessly with Automatic Stencil Printer SMT and placement machines.
High soldering quality with minimal defects
Support for complex and dense boards
Energy efficiency and process stability
Full integration support available.
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Email: Jenny@ksunsmt.com
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