Machine Specifcations | |
PCB board adjustable width | Max.50~350mm |
PCB board transport height | 750±50mm |
PCB board transportation speed | 0~1.8M/Min |
PCB board transport Angle (welding Angle) | 3 to 7 degrees |
PCB board transportation direction | L→R/R→L(Optional) |
PCB board component height limit | Max.100mm |
Length of preheating zone | 1800mm |
Number of preheating zones | 3 |
Preheating zone power | 9kw |
Preheating zone temperature | The room temperature ranges from 250 ° C |
Heating mode | Motor hot air or infrared |
Number of cooling zones | 2 |
Cooling mode | Centrifugal wind knife up and down convection refrigeration |
Solder type applicable | Lead-free solder/regular solder |
Tin furnace power | 9kw |
Amount of tin dissolved in tin furnace | Approx.280KG |
Tin furnace temperature | Room temperature ~300℃, control accuracy ±1℃ |
Temperature control mode | P.I.D+SSR |
Complete machine control mode | Siemens PLC+ LCD computer |
Flux capacity | Max reported 2 l |
Flux flow rate | 10~100ml/min |
Spray mode | Stepper motor + straddle special nozzle |
Power supply | Three phase and five wire system 380V |
Starting power | max.18kw |
Normal operating power | Approx.4kw |
Air source | 4~7KG/CM2 |
Frame size | L3600×W1400×H1700MM |
Profile size | L4400×W1400×H1700MM |
weight | Approx.1500kg |